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Intel Announces $100 Mln Fund In China To Accelerate Smart Device

Intel Corp. (INTC) announced the establishment of an Intel Smart Device Innovation Center in Shenzhen and a $100 million Intel Capital China Smart Device Innovation Fund. The chief executive Officer of Intel, Brian Krzanich, outlined new computing opportunities, investments and collaborations with burgeoning china technology ecosystem.

The CEO also detailed several new products and technologies the company will begin offering this year, including Intel Edison, a product-ready, general-purpose computing platform first imagined in the company's research labs in China.

He also announced availability of the Intel Gateway Solutions for the Internet of Things or IoT based on Intel Quark and Atom processors, and demonstrated for the first time SoFIA, Intel's first integrated mobile SoC platform for entry and value smartphones and tablets.

He said that the company will establish the Intel Smart Device Innovation Center in Shenzhen to accelerate the delivery of Intel technology-based devices to the China market and beyond.

The center will expand Intel's work beyond tablets and provide local OEMs, ODMs, and software developers with access to Intel technology platforms and enabling support, including master reference designs for turnkey solutions, development tools, supply chain sourcing, quality management and customer support - acting as a bridge between product conception and commercial deployment.

Krzanich announced the $100 million Intel Capital China Smart Device Innovation Fund focused on accelerating innovation of smart devices, including 2 in 1s, tablets, smartphones, wearables, IoT and other related technologies in China. The new investment reinforces Intel Capital's commitment to the China IT industry and ecosystem development.

Since 1998, Intel Capital has invested more than $670 million in 110 companies in China across two already-established investment funds.

Intel is also developing its SoFIA family of integrated mobile SoCs for entry and value smartphones and tablets.

The CEO also said that Intel is on track to ship 40 million tablets this year, and showcased a variety of innovative designs developed in China by OEMs and ODMs.

Intel also disclosed that the next-generation Intel Xeon processor E5-2600 v3 product family based on the Haswell microarchitecture will be in production in the second half of this year.

by RTT Staff Writer

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