logo
Share SHARE
FONT-SIZE Plus   Neg

Intel Announces $100 Mln Fund In China To Accelerate Smart Device

Intel Corp. (INTC: Quote) announced the establishment of an Intel Smart Device Innovation Center in Shenzhen and a $100 million Intel Capital China Smart Device Innovation Fund. The chief executive Officer of Intel, Brian Krzanich, outlined new computing opportunities, investments and collaborations with burgeoning china technology ecosystem.

The CEO also detailed several new products and technologies the company will begin offering this year, including Intel Edison, a product-ready, general-purpose computing platform first imagined in the company's research labs in China.

He also announced availability of the Intel Gateway Solutions for the Internet of Things or IoT based on Intel Quark and Atom processors, and demonstrated for the first time SoFIA, Intel's first integrated mobile SoC platform for entry and value smartphones and tablets.

He said that the company will establish the Intel Smart Device Innovation Center in Shenzhen to accelerate the delivery of Intel technology-based devices to the China market and beyond.

The center will expand Intel's work beyond tablets and provide local OEMs, ODMs, and software developers with access to Intel technology platforms and enabling support, including master reference designs for turnkey solutions, development tools, supply chain sourcing, quality management and customer support - acting as a bridge between product conception and commercial deployment.

Krzanich announced the $100 million Intel Capital China Smart Device Innovation Fund focused on accelerating innovation of smart devices, including 2 in 1s, tablets, smartphones, wearables, IoT and other related technologies in China. The new investment reinforces Intel Capital's commitment to the China IT industry and ecosystem development.

Since 1998, Intel Capital has invested more than $670 million in 110 companies in China across two already-established investment funds.

Intel is also developing its SoFIA family of integrated mobile SoCs for entry and value smartphones and tablets.

The CEO also said that Intel is on track to ship 40 million tablets this year, and showcased a variety of innovative designs developed in China by OEMs and ODMs.

Intel also disclosed that the next-generation Intel Xeon processor E5-2600 v3 product family based on the Haswell microarchitecture will be in production in the second half of this year.

by RTT Staff Writer

For comments and feedback: editorial@rttnews.com

Business News

Editors Pick
A new study reveals that more large companies in the U.S. are run by men with the names John, Robert, William or James than the total number of women CEOs. For each women CEO of S&P 1500 companies there are four men CEOs named John, Robert, William or James, according to a study conducted by the New... Ahead of the Ferrari IPO this year, Fiat Chrysler Automobiles said it would sell more than the 10 percent stake it initially planned in the luxury car division's public debut as investor sentiment brightens and the need to stabilize stock prices gains importance. In a thumbs up for the Iceland bond market, investors strongly oversubscribed to a bench-marked bond offering by Arion Bank, as the Nordic island country warms up to possible easy access to international credit. Arion Bank issued bonds for 300 million euros and received bids of more than 675 million euros from about 100 investors. The bonds are 3-year instruments with a fixed 3.125 percent coupon.
comments powered by Disqus
RELATED NEWS
Trade INTC now with 
Follow RTT