Dow Chemical Co. (DOW) said that it has increased its investment in programs with leading U.S. universities with a $25 million per year commitment for 10 years. The investment will be distributed among 11 institutions to strengthen research in traditional scientific fields important to Dow and to the nation's future.
Dow Electronic Materials, a business unit of The Dow Chemical Company, announced that construction is underway in Cheonan, Korea for a new manufacturing and testing facility for metallization materials used in advanced chip packaging.
Initial products manufactured in the new facility will be the components for Dow's lead-free SOLDERON BP tin-silver, which includes low-alpha tin, and electroplating (EP) copper used in INTERVIA and ULTRALINK products for advanced chip packaging and ULTRAFILL and NANOPLATE products for semiconductor applications.
In addition to manufacturing, the facility will include quality control and applications testing labs. The facility is expected to be operational in the second-quarter of 2012, with ramp up of commercial volumes throughout 2012 as customer qualifications progress.
by RTT Staff Writer
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