Taiwan Semiconductor Manufacturing Co (TSM) announced that it is extending development and production partnership with Infineon Technologies AG (IFNNY.PK) to a 65 nanometer embedded flash, or eFlash, process technology targeting next generation automotive, chip card and security applications.
Based on the agreement, Infineon and TSMC will jointly develop 65nm process technologies for eFlash microcontrollers that fulfill the stringent quality requirements of the automotive industry, as well as the demanding security requirements of the chip card and security markets.
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