Intel Corp. (INTL) and Carnegie Mellon University said that they will unveil a new class of materials called solder magnetic nanocomposites that could help streamline the process of computer electronic packaging.
The milestone research will be discussed at the 11th annual Magnetism and Magnetics Materials Conference Jan. 18-22 at the Marriott Washington Wardman Park in Washington, D.C.
McHenry, co-publication chair of the MMM/Intermag Conference, said, "By varying the concentration and composition of these magnetic particles we can control the time it takes to heat them, which ultimately helps improve the speed of processing them, and potentially lowers the cost."
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