Tegal Corp. (TGAL) said Tuesday that it has signed an agreement with Alcatel Micro Machining Systems and Alcatel-Lucent to acquire their Deep Reactive Ion Etch and Plasma Enhanced Chemical Vapor Deposition products, and the related intellectual property, directed at advanced 3-dimensional wafer-level packaging applications.
The restricted stock and cash deal, valued at US$5 million, is expected to close on or about September 16. As part of the agreement, Gilbert Bellini, President of Alcatel Micro Machining Systems, will be appointed to Tegal's Board of Directors.
At closing, Tegal will pay to Alcatel Micro Machining Systems US$1 million in cash and US$4 million worth of newly issued shares of Tegal common stock.
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