Japanese company Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing Co., Ltd. (TSM) or TSMC said Thursday that they have agreed to collaborate on 28-nanometer process technology targeted for foundry production of Fujitsu Microelectronics' 28nm logic ICs. The two companies have also agreed to jointly develop an enhanced 28nm high-performance process technology by utilizing TSMC's advanced technology platform.
Previously, both companies announced that Fujitsu Microelectronics would collaborate with TSMC on 40nm production. This collaboration will extend Fujitsu Microelectronics' 40nm collaboration with TSMC and covers joint development of an optimized 28nm high-performance process technology. Initial 28nm samples are expected to ship toward the end of 2010.
The two companies are also exploring possibilities for collaborating on advanced packaging that could include joint developments that combine Fujitsu Microelectronics' strengths in high-performance lead-free and ultra-high-pin count packaging technologies, with TSMC's strength in chip-package integration and advanced Cu/ELK interconnect.
According to Jason Chen, Vice President, Worldwide Sales and Marketing, TSMC, ''Fujitsu Microelectronics selected TSMC as a partner based in part on TSMC's unsurpassed record of developing and ramping advanced technologies. The agreement today is also a vote of confidence in TSMC's technology platforms that include design related considerations such as design kits, design flows, TSMC and 3rd party IP; robust device related documentation, processes technology excellence and backend assembly and test capabilities."
TSM closed Wednesday's regular trade at $10.53, down $0.23 or 2.14%, on 14.31 million shares.
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