Intel Corp. (INTL) and Carnegie Mellon University said that they will unveil a new class of materials called solder magnetic nanocomposites that could help streamline the process of computer electronic packaging.
The milestone research will be discussed at the 11th annual Magnetism and Magnetics Materials Conference Jan. 18-22 at the Marriott Washington Wardman Park in Washington, D.C.
McHenry, co-publication chair of the MMM/Intermag Conference, said, "By varying the concentration and composition of these magnetic particles we can control the time it takes to heat them, which ultimately helps improve the speed of processing them, and potentially lowers the cost."
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June 12, 2026 17:14 ET Major central bank action was the focus this week in economic news. The European Central Bank became the first major central bank to move in response to the rising inflationary pressures in the backdrop of the conflict in the Middle East. In North America, the U.S. inflation and trade data as well as Canada’s central bank decision gained attention. The Chinese trade data was the main news in Asia.