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Broadcom Introduces 65nm 3G HSPA Chipset Solution - Quick Facts

By RTTNews Staff Writer   ✉  | Published:  | Google News Follow Us  | Join Us
rttnewslogo20mar2024

Broadcom Corp.(BRCM) announced a new single-chip HSPA or high-speed packet access baseband processor and a radio frequency or RF transceiver solution that integrates all of the key 3G cellular and mobile technologies for powering the 3G smartphone and smart feature phone product segments.

According to the company, Designed in Broadcom's 65 nanometer CMOS process, the new '3G phone-on-a-chip' and RF solution enables manufacturers to build low cost, low power, next generation 3G HSUPA phones with breakthrough features, sleek form factors and very long battery lives.

Utilizing an integrated ARM11 processor that is capable of running popular open operating systems, the Broadcom BCM21553 HSUPA baseband processor can run innovative new applications and download media files at a much faster speed, resulting in sophisticated and affordable handsets, and a more satisfying smartphone experience, the company said.

Also introduced by the company is the Broadcom BCM2091 radio frequency transceiver that provides RF connectivity for BCM21553 HSUPA processor.

In addition, Broadcom announced next generation digital transport adapter 4.0 cable solution for Digital TV Conversion. Designed in an ultra small form factor, the Broadcom BCM7002 DTA solution supports Comcast's latest DTA 4.0 specification.

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