SK hynix Inc. (HXSCL) launched its iHBM solution, a new thermal management technology designed for next-generation high-bandwidth memory products including HBM5, aimed at improving heat dissipation in AI data centers and high-performance computing systems.
SK hynix said the iHBM solution creates an additional heat dissipation path, reducing thermal resistance by 30% and helping chips operate stably under high-temperature conditions.
The company said the solution embeds cooling elements within the HBM package to directly manage heat generated between HBM and GPUs.
The company added that its wafer-level packaging process supports stable mass production of iHBM-equipped chips. The solution is also compatible with existing System-in-Package architectures, allowing adoption with minimal design changes.
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