ASMPT Limited (0522.HK) announced that it has received new orders for 19 Chip-to-Substrate (C2S) TCB tools from a major outsourced semiconductor assembly and test (OSAT) partner of the leading foundry serving the fast-growing AI chip market.
As the sole supplier and Process of Record (POR) for this customer's C2S TCB solutions, ASMPT continues to support their high-volume manufacturing needs. The newly ordered systems will enable next-generation C2S bonding for logic applications, particularly as compound die sizes increase.
ASMPT said it is well-placed to capture further orders and expand its role in enabling the future of AI-driven semiconductor manufacturing.
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