TOPPAN, a subsidiary of TOPPAN Holdings Inc. (TPX.F), and Tekscend Photomask Corp. will join at SEMICON Japan 2025, showcasing semiconductor photomasks, advanced semiconductor packaging utilizing large glass panels, and FC-BGA substrates supporting high-performance semiconductors. It will be held from December 17 through 19 at the Tokyo Big Sight exhibition center.
TOPPAN is working to expand production capacity for Flip Chip-Ball Grid Array substrates and develop advanced semiconductor packaging technologies. TOPPAN's electronics business is targeting sustainable growth centered on semiconductor packaging.
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Business News
May 08, 2026 15:50 ET Manufacturing and services sector survey results and labor market data from main economies were the highlight on the economics news front this week. Factory orders and jobs report dominated the news flow in the U.S. Similarly, industrial production data from German garnered attention in Europe. In Asia, purchasing managers’ survey results from China and the central bank decision from Australia were in focus.